Semiconductor Equipment
Measuring micro-level gap between wafer and process head
Problem
Our customer, a semiconductor startup, sought a reliable, process-critical measurement solution for their system. The challenge was to measure very precisely a gap between the sample and the process head. Several internal and outsourced attempts had been made without success, resulting in a limited and inefficient implementation.
Solution
We conducted a comprehensive analysis of the existing setup, identifying optimization paths and evaluating alternative approaches. Our team delivered a detailed comparison outlining the advantages and trade-offs of each option. Together with the customer, we converged onto on a more effective solution and validated it through bench testing.
Result
After the 2 months study, the new solution achieved a 10X improvement in performance and significantly enhanced functionality, all while maintaining a similar overall cost. The new system has been installed on every equipment since then.